IWC Wafer Cleaning Equipments
Replaces RCA cleaning, supports 3–12 inch wafers,
and, in combination with IWC equipments, enables green cleaning with zero chemical wastewater discharge.
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Wafer Grinding, Polishing and Thinning Integrated System
1、Eliminates inter‑process wafer transfer, significantly improving throughput.
2、Replaces multiple standalone machines with a single platform, saving floor space and cost.
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