PRODUCT
TGG-P200
Basic automatic probe station supporting 4/5/6/8-inch wafer testing.
Equipment Process Overview
I. Equipment Performance
· Equipment functions : Automatic loading/unloading, automatic alignment, automatic testing, automatic marking, OCR (wafer test processes)
· Wafer sizes : 4-inch / 5-inch / 6-inch / 8-inch
· Overall accuracy : XY ±1 μm; Z ±2 μm
· Index Time : 180ms (X-6mm, Z-0.5mm)
II. Equipment Functions
· System Layout: Cassette lifting platform, upper / lower FORK, pre-alignment position, OCR unit, and chuck (with XYZθ alignment)
· Loading/unloading : Upper FORK for loading; lower FORK for unloading
· Position Calibration : Independent image correction system
· Image Alignment : Probe position – bottom CCD structure; Wafer position – top CCD structure; 5M camera with a low / high magnification optical lense and light source.
Specifications
| Parameter | Specification |
| Model | TGG - P200 |
| Automation Level | Fully Automatic |
| Power Supply | 220V，50/60Hz |
| Equipment Dimensions | 1000（W）x 1100（D）x 1400（H） |
| X/Y/Z/θ Range | 230mm、260mm、70mm、±5° |
| X/Y/Z/θ Resolution | 0.1μm、0.1μm、0.1μm、0.0001° |
| Wafer Sizes | 4" / 5" / 6" / 8" |
| Wafer Sizes | XY：±1μm Z：±2μm |
| Index Time | 180ms（X：6mm，Z：0.5mm） |
| Maximum Lifting Force | 60kg |
| Test Temperature | Room Temperature~150℃（std）- 55℃~200℃（opt） |
| Chuck Flatness | ≤8 μm (Room Temperature), ≤15 μm (High Temperature), <20 μm (Low Temperature) |
Equipment Functions
| System layout | Cassette lifting platform, upper / lower FORK, pre-alignment position, OCR unit, and chuck (with XYZθ alignment) |
|---|---|
| Loading/unloading | Upper FORK for loading; lower FORK for unloading |
| Position verification | Independent image correction system |
| Image alignment | Probe position – bottom CCD structure; Wafer position – top CCD structure; 5M camera with a low / high magnification optical lense and light source. |
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