Equipment Performance

I. Equipment Performance

· Equipment functions : Automatic loading/unloading, automatic alignment, automatic testing, automatic marking, OCR, APCC (wafer test processes)

· Wafer sizes : 8-inch / 12-inch

· Overall accuracy : XY ±1 μm; Z ±2 μm

· Index Time: 180ms (X-6mm, Z-0.5mm)

II. Equipment Functions

· System Layout : Cassette lifting platform, upper / lower FORK, pre-alignment position, OCR unit, and chuck (with XYZθ alignment)

· Loading/unloading : Upper FORK for loading; lower FORK for unloading

· Position Calibration : Independent image correction system

· Image Alignment ：Probe position – bottom CCD structure;  Wafer position – top CCD structure;  5M camera with a low / high magnification optical lense and light source.