PRODUCT
IWC Wafer Cleaning Equipments
Replaces RCA cleaning, supports 3–12 inch wafers，
and, in combination with IWC equipments, enables green cleaning with zero chemical wastewater discharge.
IWC cleaning equipment type : Single-wafer / batch-type
Processable object sizes : 3, 4, 6, 8, 12 inch
Compatible cleaning liquids : IWC (generated on‑board by integrated equipment) / various chemical solutions / DI water, etc.
IWC generation equipment, standard output : 15 L/hr (can be customized)
Equipment configuration:
Upper/lower nozzles:
DI water, air, IWC
Ultrasonic:
Flow‑through ultrasonic : 2 units, 1 MHz / 400 kHz
Vibrating‑type ultrasonic : 1 MHz
Specifications
| Specification | Single-Wafer Type | Batch Type |
| Model | LC-200/300-SW | LC-5C1D-B |
| Equipment Dimensions | 1400W x 1400D x 2050H | 5800W x 1000D x 2000H |
| Utility Requirements | DI water: IN0.2MPa over 5L/min C-PVC15A OUT C-PVC15A Drain: PVC-25A Exhaust: φ100 with suction Power: φ3 AC200V 60A Dry air: over 0.5MPa 8A | DI water: IN 0.2MPa over 5L/min C-PVC15A OUT C-PVC15A Drain: PVC-25A Exhaust: φ200 with suction Power: 3-phase AC200V 60A Dry air: φ12 |
Processing Capacity | 4min/per wafer~ | Cooling water: 15A |
Content Selection
| Parameter | Single-Wafer Type | Batch Type |
| Wafer Size | 3/4/6/8/12inch (one or more sizes must be pre-selected) | |
| Cleaning Method | Spot ultrasonic cleaning / Line-typeultrasonic brush cleaning/ Two-fluid cleaning | Ultrasonic / Immersion |
| Cleaning Liquid | IWC / DIW etc. | IWC / DIW / IPA etc. |
| Chuck Type | Edge-grip chuck | Vacuum chuck |
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