PRODUCT
TGG-P300
Basic automatic probe station supporting 8/12-inch wafer testing.
Specifications
I. Equipment Performance
· Equipment functions : Automatic loading/unloading, automatic alignment, automatic testing, automatic marking, OCR, APCC (wafer test processes)
· Wafer sizes : 8-inch / 12-inch
· Overall accuracy : XY ±1 μm; Z ±2 μm
· Index Time : 180ms (X-6mm, Z-0.5mm)
II. Equipment Functions
· System Layout: Cassette lifting platform, upper / lower FORK, pre-alignment position, OCR unit, and chuck (with XYZθ alignment)
· Loading/unloading : Upper FORK for loading; lower FORK for unloading
· Position Calibration : Independent image correction system
· Image Alignment : Probe position – bottom CCD structure; Wafer position – top CCD structure; 5M camera with a low / high magnification optical lense and light source.
Specifications
| Parameter | Specification |
| Model | TGG - P300 |
| Automation Level | Fully Automatic |
| Power Supply | 220V，50/60Hz |
| Equipment Dimensions | 1500（W）x 1680（D） x 2000（H） |
| X/Y/Z/θ Range | 460mm、480mm、70mm、±9° |
| X/Y/Z/θ Resolution | 0.1μm、0.1μm、0.1μm、0.0001° |
| Wafer Sizes | 8" / 12" |
| Overall Accuracy | XY：±1μm Z：±2μm |
| Index Time | 180ms（X：6mm，Z：0.5mm） |
| Maximum Lifting Force | 200kg / 300kg / 400kg（opt） |
| Test Temperature | Room Temperature~150℃（std）- 55℃~200℃（opt） |
| Chuck Flatness | ≤8uum (Room Temperature), ≤15 um (High Temperature), <20 uum (Low Temperature) |
Equipment Functions
| System layout | Cassette lifting platform, upper / lower FORK, pre-alignment position, OCR unit, and chuck (with XYZθ alignment) |
|---|---|
| Loading/unloading | Upper FORK for loading; lower FORK for unloading |
| Position verification | Independent image correction system |
| Image alignment | Probe position – bottom CCD structure; Wafer position – top CCD structure; 5M camera with a low / high magnification optical lense and light source. |
EN
