PRODUCT
TGG-T200
Advanced automatic probers supporting 4/5/6/8-inch wafer testing.
Equipment Overview
I. Equipment Performance
· Functions : Automatic loading/unloading, automatic alignment, automatic testing, automatic marking, and OCR (wafer test process)
· Wafer Size s: 4″, 5″, 6″, 8″
· Overall Accuracy : XY – ±1 μm; Z – ±2 μm
· Index Time : 180ms (X-6mm, Z-0.5mm)
II. Equipment Functions
· System Layout : Cassette lifting platform, upper / lower FORK, pre-alignment position, OCR unit, and chuck (with XYZθ alignment)
· Loading/Unloading : Upper FORK for wafer loading; lower FORK for unloading
· Position Calibration : Independent image-based correction system
· Image Alignment : Probe position – bottom CCD structure; Wafer position – top CCD structure; 5M camera with a low / high magnification optical lense and light source.
Specifications
| Parameter | Specification |
| Model | TGG - T200 |
| Automation Level | Fully Automatic |
| Power Supply | 220V，50/60Hz |
| Equipment Dimensions | 1000（W）x 1100（D）x 1400（H） |
| X/Y/Z/θ Range | 230mm、260mm、70mm、±5° |
| X/Y/Z/θ Resolution | 0.1μm、0.1μm、0.1μm、0.0001° |
| Wafer Sizes | 4"/5"/6"/8" |
| Overall Accuracy | XY：±1μm Z：±2μm |
| Index Time | 180ms（X：6mm，Z：0.5mm） |
| Maximum Lifting Force | 60kg |
| Test Temperature | Room Temperature~150°C (std), -55~200°C (opt) |
| Chuck Flatness | ≤8μm (Room Temperature), ≤15μm (High Temperature), <20μm (Low Temperature |
Equipment Functions
| System Layout | Cassette lifting platform, upper / lower FORK, pre-alignment position, OCR unit, and chuck (with XYZθ alignment) |
|---|---|
| Loading/Unloading | Upper FORK for loading; lower FORK for unloading |
| Position Verification | Independent image correction system |
| Image Alignment | Probe position – bottom CCD structure; Wafer position – top CCD structure; 5M camera with a low / high magnification optical lense and light source. |
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