The Wafer Grinding and Thinning Integrated System is a core equipment solution for semiconductor packaging and advanced manufacturing, specifically designed for backside thinning and surface treatment of ultra‑thin wafers. This system integrates coarse grinding, fine grinding, polishing, and tape lamination into a single, highly compact platform. After thinning and stress relief, wafers can be directly transferred to the lamination unit, effectively eliminating the risk of breakage during handling of ultra‑thin wafers.

The system features a fully automatic Dry‑in/Dry‑out loading/unloading mechanism, coupled with real‑time in‑situ thickness monitoring, ensuring superior process accuracy and consistency. It is important to note that this model supportsdry polishing only(wet polishing is not available), making it ideal for pre‑packaging processes that demand stringent surface quality. The result is a low‑stress, high‑flatness ultra‑thin wafer substrate, ready for subsequent dicing, bonding, and other critical steps.