As a prestigious event in the domestic semiconductor equipment and core components sector, this year's exhibition brought together the world's top equipment manufacturers, material suppliers, and technical service providers. Spanning 70,000 square meters of exhibition space, featuring over 1,400 exhibitors, more than 20 forums, and over 200 speakers, the event comprehensively covered the entire industry chain—from equipment, materials, and components to manufacturing, packaging, and testing.

Throughout the exhibition, the TGG Tatekawa booth welcomed numerous partners from across the industry chain, fostering lively discussions on technological innovation and product applications. We extend our heartfelt gratitude to every customer, partner, and colleague who visited us—your support made this journey a resounding success! Tatekawa (Wuxi) Semiconductor Equipment Co., Ltd. showcased its self-developed next-generation prober test systems—the TGG-T200 (compatible with 4/5/6/8-inch wafers) and the TGG-T300 (compatible with 8/12-inch wafers). Both models achieve positioning accuracy of up to 1 micron on the X and Y axes, with performance benchmarked against Tokyo Seimitsu and Tokyo Electron, dedicated to providing domestic alternative solutions for the semiconductor wafer inspection prober sector.

Over the three-day event, the TGG Semiconductor booth maintained high buzz throughout—hosting an on-site interview with Japanese media, receiving visits from several renowned Japanese semiconductor companies, and attracting numerous overseas professional visitors for engaging exchanges. Clients and partners from across the upstream and downstream value chain held in-depth discussions on product technical details and application scenarios. Looking ahead, TGG Semiconductor will continue to deepen its focus on the prober test system domain, striving to develop higher-precision inspection equipment and steadily advance toward becoming a leader in the semiconductor inspection field.